Vertical Circuits and Aptos Announce Strategic Manufacturing Agreement

Vertical Circuits (VCI), a supplier of advanced 3D die level interconnect solutions, has announced the signing of a strategic manufacturing agreement with Aptos Technology.

 

Taiwan-based Aptos Technology is a provider of memory package and memory card assembly and test services. This latest agreement calls on Aptos to provide high volume manufacturing services to VCI for its customers who are adopting VCI’s 3D vertical interconnect solutions for memory product applications.

 

Aptos officials said that their company is establishing a high volume assembly line capable of producing stacked die solutions. These solutions are based on VCI’s patented and vertical interconnect pillar (VIPTM) technology.

 

Vertical Circuits officials said that Vertical Circuits technology provides a “low cost” alternative to existing stacked die wire bond and through silicon via (TSV) interconnect solutions.

 

Vertical Circuits has licensed its VIPTM technology to global device manufacturers and packaging companies based in the U.S., Japan, and Taiwan. Thanks to VIPTM, IC assemblers such as Aptos are able to deliver stacked semiconductor die packages that “maximize silicon density and minimize the package form factor.”

 

The VIPTM technology is said to be suited for high capacity removable, and also embedded, flash memory applications, including a broad array of memory cards, USB memory, and emerging SSD products.

 

“Aptos has demonstrated world class capability and quality in delivering high density memory package assembly and test services,” said Sunil Kaul, CEO and president at Vertical Circuits.

 

He also said that the combination of Aptos’s extensive assembly experience for the world’s leading flash memory providers and VCI’s low cost VIPTM technology enables his company to offer an immediate, high volume manufacturing solution to the growing customer base.

 

“We believe this partnership will further advance our ability to establish VCI’s VIPTM as the new standard interconnect solution for high density memory components,” said Kaul.

 

 

“Our partnership with Vertical Circuits allows Aptos to continue to deliver leading high density, low cost stacked memory components,” said Daniel Jow, chairman at Aptos. “The proven VIPTM technology seamlessly integrates into our existing high volume manufacturing lines and enables us to bring the technology to the market in a very short time.